Amkor Technology (NASDAQ:AMKR – Get Free Report) released its quarterly earnings data on Monday. The semiconductor company reported $0.43 earnings per share for the quarter, beating the consensus estimate of $0.37 by $0.06, Zacks reports. Amkor Technology had a return on equity of 8.98% and a net margin of 5.68%. Amkor Technology updated its Q1 2025 guidance to 0.010-0.170 EPS.
Amkor Technology Price Performance
Shares of NASDAQ AMKR opened at $21.59 on Wednesday. The firm has a market capitalization of $5.32 billion, a P/E ratio of 14.59 and a beta of 1.81. The firm’s 50-day moving average price is $25.62 and its 200-day moving average price is $28.20. The company has a current ratio of 2.06, a quick ratio of 1.84 and a debt-to-equity ratio of 0.21. Amkor Technology has a 1-year low of $21.59 and a 1-year high of $44.86.
Wall Street Analysts Forecast Growth
Several analysts have recently weighed in on AMKR shares. The Goldman Sachs Group reduced their price target on Amkor Technology from $36.00 to $32.00 and set a “neutral” rating on the stock in a report on Tuesday, October 29th. Morgan Stanley reduced their target price on shares of Amkor Technology from $26.00 to $24.00 and set an “equal weight” rating on the stock in a report on Tuesday. StockNews.com downgraded shares of Amkor Technology from a “buy” rating to a “hold” rating in a research note on Tuesday, October 29th. KeyCorp reduced their price objective on shares of Amkor Technology from $38.00 to $34.00 and set an “overweight” rating on the stock in a research note on Tuesday, October 29th. Finally, Melius downgraded Amkor Technology from a “buy” rating to a “hold” rating and decreased their price objective for the company from $34.00 to $30.00 in a report on Monday, January 6th. Six analysts have rated the stock with a hold rating and five have assigned a buy rating to the company’s stock. According to MarketBeat.com, the company currently has an average rating of “Hold” and an average target price of $31.50.
About Amkor Technology
Amkor Technology, Inc provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage.
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