ACM Research (NASDAQ:ACMR) Updates Revenue Outlook for 2024 and Provides Initial Guidance for 2025

ACM Research, Inc. (NASDAQ:ACMR) recently released a press update on January 14, 2025, titled “ACM Research Updates 2024 Revenue Outlook and Provides Initial Outlook for 2025 Revenue.” The company, a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, has adjusted its full-year 2024 revenue outlook to a range of $755 million to $770 million. This updated range surpasses the previously estimated range of $725 million to $745 million, as per ACM’s third quarter 2024 earnings release on November 7, 2024.

Looking forward to 2025, ACM Research anticipates its revenue for the entire year to fall between $850 million to $950 million. This projection is grounded on the current assessment by ACM’s management of factors like international trade policies, anticipated spending patterns of key customers, supply chain constraints, and the timing of acceptances for initial tools under evaluation in the field, among other considerations.

The President and Chief Executive Officer of ACM, Dr. David Wang, expressed optimism about the projected growth in 2025 despite the dynamic geopolitical landscape. He highlighted the company’s expectations of ongoing investments in production capacity by customers in mainland China, along with contributions from new products like single-wafer SPM, Tahoe, Furnace, among others. Dr. Wang also mentioned the manageable impact on the supply chain from the recently imposed U.S. component export restrictions on ACM Shanghai’s tool production. Additionally, ACM remains dedicated to creating top-tier tools to expand its market presence beyond mainland China.

ACM Research plans to unveil its financial results for the fourth quarter and full year of 2024 in late February 2025. It’s important to note that the 2024 revenue outlook shared is provisional, subject to review, and audit procedures by ACM’s independent registered public accounting firm.

Upcoming engagements for ACM include participation in group and one-on-one meetings by UBS on January 15, 2025, in Pudong, Shanghai, followed by a virtual presentation and one-on-one meetings at the 27th Annual Needham Growth Conference on January 16, 2025.

About ACM Research, Inc.
ACM is dedicated to developing, producing, and selling semiconductor process equipment that encompasses various critical processes in semiconductor device manufacturing. The company’s offerings include solutions for cleaning, electroplating, polishing, furnace processes, PECVD, and wafer- and panel-level packaging tools, enhancing productivity and product yield for semiconductor manufacturers.

Forward-Looking Statements
Some statements in the press release contain forward-looking information within the meaning of the Private Securities Litigation Reform Act of 1995. ACM Research’s management uses words like “plans,” “expects,” “believes,” and others to indicate such forward-looking statements. These statements involve risks and uncertainties that could lead to differing actual results.

It is advised not to solely rely on these statements as they are based on current expectations and are subject to change based on events and circumstances.

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This article was generated by an automated content engine and was reviewed by a human editor prior to publication. For additional information, read ACM Research’s 8K filing here.

About ACM Research

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ACM Research, Inc, together with its subsidiaries, develops, manufactures, and sells single-wafer wet cleaning equipment for enhancing the manufacturing process and yield for integrated chips worldwide. It offers space alternated phase shift technology for flat and patterned wafer surfaces, which employs alternating phases of megasonic waves to deliver megasonic energy in a uniform manner on a microscopic level; timely energized bubble oscillation technology for patterned wafer surfaces at advanced process nodes, which provides cleaning for 2D and 3D patterned wafers; Tahoe technology for delivering cleaning performance using less sulfuric acid and hydrogen peroxide; and electro-chemical plating technology for advanced metal plating.

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