Fabrinet (NYSE:FN) Announces Quarterly Earnings Results, Misses Estimates By $0.10 EPS

Fabrinet (NYSE:FN) posted its quarterly earnings data on Monday. The technology company reported $2.38 EPS for the quarter, missing the consensus estimate of $2.48 by ($0.10), Zacks reports. Fabrinet had a return on equity of 18.08% and a net margin of 10.28%. Fabrinet updated its Q3 2025 guidance to 2.550-2.630 EPS.

Fabrinet Trading Up 4.9 %

FN traded up $10.64 on Monday, hitting $226.85. The company had a trading volume of 1,400,299 shares, compared to its average volume of 628,724. The company’s fifty day moving average price is $231.04 and its 200 day moving average price is $234.45. Fabrinet has a 1 year low of $159.69 and a 1 year high of $281.79. The firm has a market cap of $8.23 billion, a P/E ratio of 26.85 and a beta of 0.92.

Wall Street Analyst Weigh In

A number of equities research analysts have issued reports on the company. Needham & Company LLC started coverage on Fabrinet in a research note on Tuesday, November 5th. They issued a “buy” rating and a $280.00 price target for the company. Barclays assumed coverage on Fabrinet in a research note on Thursday, November 14th. They set an “equal weight” rating and a $292.00 target price on the stock. Finally, B. Riley downgraded shares of Fabrinet from a “neutral” rating to a “sell” rating and dropped their target price for the stock from $194.00 to $178.00 in a research note on Wednesday, November 20th. One analyst has rated the stock with a sell rating, three have assigned a hold rating and three have assigned a buy rating to the company. According to data from MarketBeat, the stock presently has a consensus rating of “Hold” and a consensus price target of $252.14.

Fabrinet Company Profile

Fabrinet provides optical packaging and precision optical, electro-mechanical, and electronic manufacturing services in North America, the Asia-Pacific, and Europe. The company offers a range of advanced optical and electro-mechanical capabilities in the manufacturing process, including process design and engineering, supply chain management, manufacturing, printed circuit board assembly, advanced packaging, integration, final assembly, and testing.